By: Parthajit - Samsung has started mass production of 1gigabit (gb) DDR2 DRAM memory using 80nanometer process technology.

Samsung reportedly seeks to produce the world's smallest DRAM package at 11x11.5mm.

Samsung noted that most 1gb DRAM chips are stacked in high-capacity DRAM modules for next-generation servers. These modules include the 4GB fully buffered Dual In-line Memory Module (DIMM) and the 2GB Small Outline Dual Inline Memory Module (SODIMM).

Samsung informed that thirty-six 1gb DRAM chips are needed to create a 4GB module, which had to be configured either by stacking two chips on top of one another or by enclosing two chips into the same package. Avoiding chip stacking simplifies the production process, lowers production costs and enhances overall electrical properties, the company noted.

Samsung is now producing all densities of DDR2 DRAM at the 80nm node. It has reportedly been producing the first 512mb DDR2 DRAM at the 80nm node since March.
Source: digital media news for Asia